HDI PCB

hdi PCB

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What is HDI PCB?

We specialize in manufacturing high-quality HDI PCBs that meet the demanding requirements of modern electronics. With over 24 years of experience in the PCB industry and advanced manufacturing capabilities, we deliver HDI solutions that push the boundaries of miniaturization and performance.

hdi pcb

HDI (High-Density Interconnect) PCB is an advanced circuit board technology that features higher wiring density per unit area compared to traditional PCBs. By utilizing microvias, fine lines, and advanced build-up technologies, HDI PCBs enable more complex circuit designs in smaller form factors with superior electrical performance.

Key Features of HDI PCBs

Microvias The defining characteristic of HDI technology, microvias are small laser-drilled holes typically 0.15mm (6 mil) or less in diameter. These tiny connections enable:

  • Higher routing density in limited space
  • Reduced signal path length
  • Improved electrical performance
  • Layer-to-layer connections without through-holes

Fine Line and Space HDI PCBs feature much finer trace widths and spacing:

  • Line width/spacing down to 3/3 mil (0.075/0.075mm)
  • Enables more routing channels between component pads
  • Supports ultra-fine pitch components
  • Maximizes usable board area

Advanced Layer Stack-ups HDI designs utilize sophisticated layer structures:

  • Multiple build-up layers
  • Sequential lamination processes
  • Any-layer via structures
  • Optimized signal integrity and power distribution

HDI Structure Types

1+N+1 Build-up

  • One build-up layer on each side of a core
  • Most economical HDI structure
  • Suitable for many consumer electronics applications
  • Good balance of performance and cost

2+N+2 Build-up

  • Two build-up layers on each side of a core
  • Higher routing density than 1+N+1
  • Better electrical performance
  • Common in smartphones and tablets

3+N+3 Build-up

  • Three build-up layers on each side of a core
  • Very high density capability
  • Supports complex, high-pin-count components
  • Used in advanced computing and communication devices

Any-Layer HDI

  • Vias can connect any layers in the stack-up
  • Maximum design flexibility and routing density
  • Highest performance HDI structure
  • Required for cutting-edge applications

Coreless HDI

  • No traditional core material, built entirely with sequential lamination
  • Thinnest possible board construction
  • Excellent electrical performance
  • Used in ultra-thin devices like smartwatches

Advantages of HDI Technology

Miniaturization HDI enables dramatic size reduction compared to traditional PCBs. The same functionality can be achieved in a board 25-50% smaller, critical for compact devices like smartphones, wearables, and portable medical equipment.

Enhanced Electrical Performance

  • Shorter Signal Paths: Reduced inductance and capacitance
  • Lower EMI: Better electromagnetic compatibility
  • Improved Signal Integrity: Cleaner signals with less crosstalk
  • Better Impedance Control: More precise transmission line characteristics
  • Reduced Power Consumption: Shorter traces mean lower resistance and power loss

Higher Component Density

  • Support for fine-pitch BGAs (0.4mm pitch and below)
  • Chip-scale packages (CSP) and wafer-level packages
  • Multiple high-pin-count components on a single board
  • More functionality in less space

Reliability Improvements

  • Fewer layers required for the same functionality
  • Better thermal management with microvias
  • Reduced aspect ratios improve plating quality
  • Enhanced mechanical stability

Cost Efficiency While HDI manufacturing is more complex, it can reduce overall costs through:

  • Smaller board size reducing material costs
  • Fewer layers in many designs
  • Higher assembly yields
  • Reduced component count through integration

FAST-PCB HDI Manufacturing Capabilities

Microvia Specifications

  • Laser-drilled microvias: 0.1mm – 0.15mm (4-6 mil) diameter
  • Aspect ratio: Up to 1:1 for microvias
  • Via filling: Resin filled, copper filled, or plated
  • Stacked vias, staggered vias, and via-in-pad configurations

Fine Line Capabilities

  • Minimum trace width: 3 mil (0.075mm)
  • Minimum spacing: 3 mil (0.075mm)
  • Outer layer: 3/3 mil
  • Inner layer: 4/4 mil

Layer Count

  • Standard: 4-16 layers
  • Advanced: Up to 20+ layers
  • Build-up layers: 1-3 on each side
  • Any-layer HDI structures available

Board Specifications

  • Minimum board thickness: 0.4mm
  • Build-up layer thickness: 0.05-0.1mm per layer
  • Finished copper weight: 0.5-2 oz
  • Maximum board size: 500mm x 600mm

Surface Finishes

  • ENIG (Electroless Nickel Immersion Gold)
  • Immersion Silver
  • Immersion Tin
  • OSP (Organic Solderability Preservative)
  • ENEPIG (for wire bonding applications)